This device measures the thickness of wafers and display panels after partial processes such as wafer slicing, grinding, thinning, and slicing. Can synchronously test the TTVBOWWRAP/SORI and other parameter errors of the material itself.
																											
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 Consultation Hotline:86-0592-3799658、86-137 9991 1773(Switchboard)
Consultation Hotline:86-0592-3799658、86-137 9991 1773(Switchboard)
                            
 
                            